Permanent electrostatic discharge protection — conductive carbon black dispersed throughout every layer. Not a coating, not a treatment. Built in.
Most ESD filaments target the dissipative range (10⁶–10⁹ Ω). This filament sits in the conductive range (~10⁴ Ω) — charge drains almost instantly. For component trays, handling fixtures, and ESD packaging where charge must reach ground through the part, conductive-range performance is faster, more reliable, and the correct specification.
| Surface Resistivity | ~1.0 × 10⁴ ΩIEC 61340-2-3 |
| Volume Resistivity | <1.0 × 10³ Ω·cmIEC 61340-2-3 |
| Classification | Electrically Conductive |
| ESD Stability | PermanentNot humidity-dependent |
| Additive | Conductive Carbon Black |
| Tensile Strength (yield) | 26.0 MPaISO 527-2 |
| Tensile Strength (break) | 20.0 MPaISO 527-2 |
| Elongation at Break | 25%ISO 527-2 |
| Flexural Modulus | 2,020 MPaISO 178 |
| Impact Strength (Izod) | 9.0 kJ/m²ISO 180/A · 23°C |
| Shore D Hardness | 73ISO 868 · 15 sec |
| HDT (1.8 MPa) | 67°CISO 75-2/A |
| Vicat Softening Temp. | 100°CISO 306/A |
Dry at 80°C for 2–3 hours before every print. Moisture disrupts the carbon black network and produces parts that fail ESD testing — even if they look correct.
| Parameter | Value | Notes |
|---|---|---|
| Drying Temperature | 80°C | Mandatory before printing |
| Drying Time | 2–3 hours | Longer in humid conditions |
| Nozzle Temperature | 200–230°C | Do not exceed 230°C melt temp |
| Bed Temperature | 90–110°C | PEI sheet recommended |
| Enclosure | Required | 40–55°C ambient target |
| Print Speed | 30–50 mm/s | Slower = better ESD consistency |
| Min. Infill (ESD parts) | 40% | Below 40% breaks Z-axis conductivity |
| Cooling Fan | Off / ≤15% | Prevents warping and delamination |
| Storage | Sealed + desiccant | Re-dry after 24h open air |
Component trays, PCB holding jigs, test fixtures, and probe guides for SMD and through-hole assembly lines.
IC carriers, JEDEC tray replicas, wafer cassette spacers, and burn-in socket inserts for fab environments.
ECU assembly fixtures, ADAS sensor testing brackets, and HV battery module handling trays for IATF 16949 lines.
Avionics bay component mounts, conformal coating masks, and connector protectors for low-volume critical assemblies.
ESD-safe gripper fingers, robotic component presentation trays, and ATE sensor mounts in automated test racks.
Custom transit trays for electronic components — direct replacement for injection-moulded ESD packaging with no tooling cost.
Carbon black dispersed throughout the polymer matrix — not a surface coating. ESD performance does not degrade with age, cleaning, or humidity variation.
Resistivity values measured per IEC 61340-2-3. Supports ANSI/ESD S20.20 and IEC 61340-5-1 compliance documentation. Datasheet on request.
Replace injection-moulded ESD trays and fixtures with 3D printed parts — no tooling cost, no minimum order, custom geometry in days.
Full datasheet on request. Our team can help you select the right ESD material for your application.
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